MOS管电(dian)压(ya)控制电(dian)流-MOS管可控双导游(you)电(dian)特性及FET压(ya)控制器件等详解-KIA MOS管
信息来(lai)源:本站 日期(qi):2018-07-20
目前,曾经适用化的全控(kong)型晶(jing)体(ti)管(guan)大(da)(da)(da)致(zhi)有这(zhei)么几大(da)(da)(da)类:BJT、FET、IGBT,GTO(Gatc Turn-Off Thyristor,可关(guan)断晶(jing)闸管(guan))、1GCT (Integrated Gatc-Com-mutated Thyristor,集成门极单向晶(jing)闸管(guan))。IGBT、GTO、IGCT -般只用于电流开(kai)关(guan)放大(da)(da)(da),即大(da)(da)(da)功带领(ling)域,而(er)不会用于小(xiao)信号电压放大(da)(da)(da)范(fan)畴(chou),因而(er)常常将三者(zhe)划(hua)归功率(lv)半导体(ti)、半导体(ti)范(fan)畴(chou)。同(tong)时跨两个范(fan)畴(chou)的是BJT和(he)FET。
所(suo)谓全(quan)控(kong)(kong)(kong)型(xing),指的(de)(de)是(shi)仅仅依托控(kong)(kong)(kong)制(zhi)端子(基极(ji)(ji)(ji)/栅极(ji)(ji)(ji)/控(kong)(kong)(kong)制(zhi)极(ji)(ji)(ji))的(de)(de)信号,晶(jing)体(ti)(ti)管(guan)能(neng)够(gou)自主翻(fan)开(kai)和(he)关(guan)(guan)断,可(ke)控(kong)(kong)(kong)硅的(de)(de)控(kong)(kong)(kong)制(zhi)极(ji)(ji)(ji)只能(neng)控(kong)(kong)(kong)制(zhi)开(kai)的(de)(de)动作(zuo),却(que)不(bu)能(neng)关(guan)(guan)闭可(ke)控(kong)(kong)(kong)硅,这样的(de)(de)器(qi)件(jian)(jian)(jian)称为半控(kong)(kong)(kong)型(xing)半导(dao)(dao)体(ti)(ti)器(qi)件(jian)(jian)(jian)。GTO和(he)IGCT固然属于全(quan)控(kong)(kong)(kong)型(xing)器(qi)件(jian)(jian)(jian),但(dan)实践上(shang)是(shi)应用了集(ji)成(cheng)技术,集(ji)成(cheng)了若干控(kong)(kong)(kong)制(zhi)电(dian)路,固然对外电(dian)路而(er)言(yan)依然是(shi)三端器(qi)件(jian)(jian)(jian)(适用的(de)(de)IGCT常(chang)常(chang)是(shi)一(yi)个基于印制(zhi)板(ban)的(de)(de)电(dian)路组件(jian)(jian)(jian)),但(dan)它(ta)们的(de)(de)内部曾(ceng)经(jing)不(bu)是(shi)单一(yi)的(de)(de)硅片构造(zao)。从(cong)实践应用上(shang)来说(shuo),晶(jing)体(ti)(ti)管(guan)的(de)(de)导(dao)(dao)通(tong)实践上(shang)能(neng)够(gou)有两种状态:放(fang)大(da)与饱(bao)和(he)导(dao)(dao)通(tong),前者用于电(dian)压放(fang)大(da),后者用于电(dian)放(fang)逐大(da),GTO与IGCT实践上(shang)只要后者。从(cong)这个意义(yi)上(shang)来说(shuo),比(bi)拟地道的(de)(de)全(quan)控(kong)(kong)(kong)型(xing)半导(dao)(dao)体(ti)(ti)器(qi)件(jian)(jian)(jian)实践上(shang)只要BJT、FET、IGBT。基于这些理由,本节以BJT、FET、IGBT为例来看(kan)一(yi)下FET的(de)(de)典型(xing)特征(个性)。
这(zhei)一点IGBT与(yu)之(zhi)相(xiang)同(tong)。 BJT的(de)基(ji)极需求(qiu)电压和电流才干使BJT导通,简单地(di)说(shuo),BJT的(de)控(kong)制需求(qiu)一定的(de)功(gong)(gong)(gong)率(lv)。FET的(de)栅极只需求(qiu)一个控(kong)制电压即(ji)可,控(kong)制功(gong)(gong)(gong)率(lv)能(neng)(neng)够疏(shu)忽。当然,由于结电容(rong)的(de)存在(zai)(zai),高频应用时,压控(kong)型器件依(yi)然要耗费一定的(de)控(kong)制功(gong)(gong)(gong)率(lv),在(zai)(zai)这(zhei)一点上,BJT也是一样的(de),只不(bu)过结电容(rong)耗费的(de)功(gong)(gong)(gong)率(lv)与(yu)基(ji)极所(suo)需求(qiu)的(de)驱动(dong)功(gong)(gong)(gong)率(lv)相(xiang)比,常常是能(neng)(neng)够疏(shu)忽的(de)。
常开(kai)(kai)与常闭在(zai)常态下(xia)(xia),JFET是(shi)(shi)导(dao)通的,而(er)(er)BJT则是(shi)(shi)关(guan)(guan)(guan)闭的,就(jiu)像一(yi)(yi)扇(shan)门(men),关(guan)(guan)(guan)于(yu)BJT而(er)(er)言,这(zhei)扇(shan)门(men)是(shi)(shi)关(guan)(guan)(guan)闭的,而(er)(er)关(guan)(guan)(guan)于(yu)JFET,这(zhei)扇(shan)门(men)是(shi)(shi)翻(fan)开(kai)(kai)的,我们所需(xu)(xu)求(qiu)的控(kong)制,前(qian)者(zhe)的目的是(shi)(shi)翻(fan)开(kai)(kai),然后者(zhe)是(shi)(shi)将其关(guan)(guan)(guan)闭。在(zai)常态下(xia)(xia),加强(qiang)(qiang)型MOSFET与BJT 一(yi)(yi)样都是(shi)(shi)关(guan)(guan)(guan)闭的,但(dan)是(shi)(shi)状况并不(bu)完整相同,只(zhi)(zhi)需(xu)(xu)有偏置电(dian)(dian)压(ya),BJT就(jiu)会翻(fan)开(kai)(kai),而(er)(er)MOSFET则至少需(xu)(xu)求(qiu)1V以(yi)上,通常是(shi)(shi)4-5V,这(zhei)个电(dian)(dian)压(ya)称为“开(kai)(kai)启阈值电(dian)(dian)压(ya)”或者(zhe)“门(men)限电(dian)(dian)压(ya)”。就(jiu)像一(yi)(yi)扇(shan)门(men),BJT足一(yi)(yi)扇(shan)光滑(hua)十分(fen)好(hao)的门(men),只(zhi)(zhi)需(xu)(xu)稍(shao)稍(shao)用力(li),或者(zhe)只(zhi)(zhi)需(xu)(xu)有推门(men)的力(li)存(cun)在(zai),哪怕(pa)是(shi)(shi)一(yi)(yi)阵微(wei)风(feng),都能(neng)使门(men)翻(fan)开(kai)(kai)一(yi)(yi)条缝;加强(qiang)(qiang)型MOSFET则是(shi)(shi)一(yi)(yi)扇(shan)装有闭门(men)器的门(men),推门(men)的力(li)需(xu)(xu)求(qiu)到(dao)达一(yi)(yi)定的水平,门(men)才会开(kai)(kai)端翻(fan)开(kai)(kai)。
所(suo)谓(wei)转(zhuan)移(yi)特性(xing),大致是(shi)指(zhi)存(cun)饱(bao)和(he)导通条件(jian)(jian)(jian)下(xia)的(de)(de)(de)输(shu)入信(xin)号对输(shu)出(chu)信(xin)号的(de)(de)(de)控(kong)制(zhi)(zhi)(zhi)特性(xing),即(ji)控(kong)制(zhi)(zhi)(zhi)信(xin)号变化时,输(shu)出(chu)信(xin)号的(de)(de)(de)变化规律。详细到FET,是(shi)指(zhi)漏极(ji)电流(liu)与栅极(ji)电压的(de)(de)(de)关系。FET的(de)(de)(de)转(zhuan)移(yi)特性(xing)大致为(wei)抛物线,也(ye)(ye)能(neng)够描绘为(wei)漏极(ji)电流(liu)与栅极(ji)电压为(wei)平方率关系。有(you)这种转(zhuan)移(yi)特性(xing)的(de)(de)(de)半(ban)导体(ti)器(qi)(qi)件(jian)(jian)(jian)没有(you)三(san)次(ci)交(jiao)调(diao)噪(zao)声(sheng)(sheng),也(ye)(ye)没有(you)更高次(ci)谐波(bo)的(de)(de)(de)调(diao)制(zhi)(zhi)(zhi)噪(zao)声(sheng)(sheng)。所(suo)谓(wei)交(jiao)调(diao)噪(zao)声(sheng)(sheng),也(ye)(ye)叫交(jiao)扰调(diao)制(zhi)(zhi)(zhi)噪(zao)声(sheng)(sheng),是(shi)指(zhi)两个不同频率的(de)(de)(de)信(xin)号在同一(yi)器(qi)(qi)件(jian)(jian)(jian)中相互(hu)调(diao)制(zhi)(zhi)(zhi)而产生的(de)(de)(de)一(yi)种噪(zao)声(sheng)(sheng)。交(jiao)扰调(diao)制(zhi)(zhi)(zhi)和(he)调(diao)制(zhi)(zhi)(zhi)噪(zao)声(sheng)(sheng)是(shi)混频器(qi)(qi)尽可(ke)能(neng)要防止的(de)(de)(de),因而高级的(de)(de)(de)收音头会采用(yong)FET器(qi)(qi)件(jian)(jian)(jian)做(zuo)混频器(qi)(qi)件(jian)(jian)(jian),常(chang)见的(de)(de)(de)有(you)双栅极(ji)的(de)(de)(de)MOSFET。
除了串(chuan)联等一些特殊应(ying)(ying)用(yong),JFET的(de)(de)(de)(de)(de)(de)漏极(ji)(ji)和(he)(he)(he)源(yuan)(yuan)极(ji)(ji)在(zai)应(ying)(ying)用(yong)上(shang)并无区别(bie),能(neng)够互换运用(yong),因(yin)而,JFET漏极(ji)(ji)和(he)(he)(he)源(yuan)(yuan)极(ji)(ji)在(zai)普(pu)通(tong)应(ying)(ying)用(yong)中能(neng)够对调,电(dian)路性(xing)能(neng)并无区别(bie)。基于这个原理,将D、S对调,图1.1中的(de)(de)(de)(de)(de)(de)电(dian)路方式(shi)能(neng)够演化出另外两种(zhong)。也正是(shi)由(you)(you)于这个缘(yuan)由(you)(you),有些电(dian)路符号会将JFET的(de)(de)(de)(de)(de)(de)栅极(ji)(ji)画在(zai)正中的(de)(de)(de)(de)(de)(de)位(wei)置而不是(shi)偏(pian)下的(de)(de)(de)(de)(de)(de)位(wei)置,以(yi)表示漏极(ji)(ji)和(he)(he)(he)源(yuan)(yuan)极(ji)(ji)的(de)(de)(de)(de)(de)(de)外部功用(yong)是(shi)相(xiang)同(tong)的(de)(de)(de)(de)(de)(de)。5.VMOS的(de)(de)(de)(de)(de)(de)个性(xing):可(ke)变的(de)(de)(de)(de)(de)(de)饱(bao)(bao)(bao)和(he)(he)(he)导(dao)(dao)(dao)通(tong)压(ya)(ya)(ya)降,不变的(de)(de)(de)(de)(de)(de)饱(bao)(bao)(bao)和(he)(he)(he)导(dao)(dao)(dao)通(tong)电(dian)阻(zu)BJT的(de)(de)(de)(de)(de)(de)饱(bao)(bao)(bao)和(he)(he)(he)导(dao)(dao)(dao)通(tong)压(ya)(ya)(ya)降简直是(shi)恒定(ding)的(de)(de)(de)(de)(de)(de),关(guan)于硅管(guan)而言,大致为0.7V,关(guan)于锗(zhe)管(guan)而言,为o.3V左右,由(you)(you)于锗(zhe)管(guan)的(de)(de)(de)(de)(de)(de)温度特性(xing)不佳,因(yin)而硅管(guan)愈加常用(yong)。MOSFET的(de)(de)(de)(de)(de)(de)饱(bao)(bao)(bao)和(he)(he)(he)导(dao)(dao)(dao)通(tong)压(ya)(ya)(ya)降不是(shi)恒定(ding)的(de)(de)(de)(de)(de)(de),饱(bao)(bao)(bao)和(he)(he)(he)导(dao)(dao)(dao)通(tong)电(dian)阻(zu)(RDS(ON))却是(shi)一定(ding)的(de)(de)(de)(de)(de)(de)(温度相(xiang)同(tong)条件下),因(yin)而VMOS的(de)(de)(de)(de)(de)(de)饱(bao)(bao)(bao)和(he)(he)(he)导(dao)(dao)(dao)通(tong)压(ya)(ya)(ya)降取(qu)决于电(dian)路巾(jin)流过的(de)(de)(de)(de)(de)(de)电(dian)流。VMOS的(de)(de)(de)(de)(de)(de)饱(bao)(bao)(bao)和(he)(he)(he)导(dao)(dao)(dao)通(tong)电(dian)阻(zu)主要和(he)(he)(he)电(dian)压(ya)(ya)(ya)规(gui)格(俗称“耐压(ya)(ya)(ya)”)有关(guan),电(dian)压(ya)(ya)(ya)规(gui)格越高,饱(bao)(bao)(bao)和(he)(he)(he)导(dao)(dao)(dao)通(tong)电(dian)阻(zu)越大。低电(dian)压(ya)(ya)(ya)规(gui)格的(de)(de)(de)(de)(de)(de)VMOS的(de)(de)(de)(de)(de)(de)饱(bao)(bao)(bao)和(he)(he)(he)导(dao)(dao)(dao)电(dian)阻(zu)普(pu)通(tong)在(zai)mΩ级。
8205,饱(bao)和导通(tong)电(dian)(dian)(dian)(dian)阻(zu)的(de)(de)典型(xing)值(zhi)为30mΩ,TJ(结温,近似为晶体管硅片的(de)(de)温度(du)(du))为100℃的(de)(de)时分,饱(bao)和导通(tong)电(dian)(dian)(dian)(dian)阻(zu)为40mΩ。不难算出(chu),手(shou)机的(de)(de)工(gong)作电(dian)(dian)(dian)(dian)流即便到(dao)(dao)达0.5A(实践上普(pu)通(tong)远小于(yu)这个(ge)数(shu)值(zhi)),两(liang)个(ge)电(dian)(dian)(dian)(dian)子开关(guan)的(de)(de)压(ya)(ya)降也只要30mV,思索到(dao)(dao)温度(du)(du)的(de)(de)要素,也不会超越40mV。假如采用(yong)BJT,上述压(ya)(ya)降就(jiu)会到(dao)(dao)达1.4V左右,这个(ge)数(shu)值(zhi)与(yu)8205上的(de)(de)压(ya)(ya)降相比,是(shi)不是(shi)简直能够疏忽(hu)?这就(jiu)是(shi)图(tu)1.3要采用(yong)VMOS的(de)(de)缘由。当然(ran),VMOS的(de)(de)饱(bao)和导通(tong)电(dian)(dian)(dian)(dian)阻(zu)也不总是(shi)这么小,随着(zhe)电(dian)(dian)(dian)(dian)压(ya)(ya)规(gui)格的(de)(de)进步,这个(ge)数(shu)值(zhi)会疾速上升。虽然(ran)如此(ci),在电(dian)(dian)(dian)(dian)压(ya)(ya)规(gui)格小于(yu)200V的(de)(de)普(pu)通(tong)应用(yong)中(zhong),它的(de)(de)饱(bao)和压(ya)(ya)降依然(ran)有(you)绝(jue)对的(de)(de)优(you)势。
IGBT的(de)(de)饱和压降与BJT的(de)(de)特性(xing)相似,普(pu)通为(wei)1.5~3V,与电压规(gui)格有(you)关,因(yin)而,在(zai)高压规(gui)格(600~1200V)的(de)(de)晶体管中,IGBT有(you)优势,它更大(da)的(de)(de)优势是(shi),IGBT的(de)(de)电压规(gui)格目(mu)前可以(yi)做到很高,不但远(yuan)远(yuan)高于FET,也远(yuan)远(yuan)高于BJT,实用产品曾经到达了4. 3kV~6. 5kV,而适用的(de)(de)VMOS,最高的(de)(de)电压规(gui)格大(da)致为(wei)lkV~l. 2kV。
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